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Solder pallet, the basic unit of surface mount assembly, is used to form the solder pallet pattern of the circuit board, that is, a combination of various solder pallet materials designed for special component types. When a solder pallet structure is not designed correctly, it is difficult, sometimes impossible, to achieve the intended solder joint. There are two words for solder pallet: Land and Pad, and are often used interchangeably; however, functionally, Land is a two-dimensional surface feature used for surface mountable components, while Pad is a three-dimensional feature used for pluggable components. As a general rule, Land does not include PTH, plated through-hole. Vias are plated through holes (PTHs) that connect different circuit layers. A blind via is a buried via that connects the outermost layer and one or more inner layers, and only connects the inner layers.
Epoxy sheet is also called insulating board, epoxy board, 3240 epoxy board. Epoxy resins generally refer to organic polymer compounds containing two or more epoxy groups in the molecule. Except for a few, their relative molecular mass is not high. The molecular structure of epoxy resin is characterized by the presence of active epoxy groups in the molecular chain, and the epoxy groups can be located at the end, middle or cyclic structure of the molecular chain. Due to the active epoxy groups in the molecular structure, they can be cross-linked with various types of curing agents to form insoluble and infusible polymers with a three-way network structure. The existence of polar hydroxyl and ether bonds inherent in the molecular chain of epoxy resin makes it have high adhesion to various substances. Epoxy resins have low shrinkage when cured and generate little internal stress, which also contributes to improved adhesion strength.
Fiberglass board alias: fiberglass insulation board, fiberglass board (FR-4), fiberglass composite board, etc. It is composed of fiberglass material and composite material with high heat resistance, and does not contain asbestos harmful to human body. It has high mechanical properties and dielectric properties, good heat resistance and moisture resistance, and good processability. For plastic molds, injection molds, machinery manufacturing, molding machines, drilling machines, injection molding machines, motors, PCB, ICT fixtures, table grinding pads. Injection mold molding usually requires: high temperature material and low temperature mold. In the same machine condition, the heat insulation method must be adopted.
Phenolic sheet is made of phenolic foam material, which is a polymer organic rigid aluminum foil foam product, which is foamed by thermosetting phenolic resin. Phenolic insulation boards are widely used in developed countries. According to statistics and literature records, 40% of fire-proof, thermal-insulation and sound-insulation materials in the United States are phenolic resins; the United Kingdom, Western Europe, and the Middle East stipulate that phenolic foam thermal insulation materials are preferred for new construction projects; Construction departments in France and Northern Europe believe that only phenolic foam insulation materials have good fire performance.